AMD Deepens Samsung Ties to Support Next-Gen AI Chips

AMD signed a memorandum of understanding with Samsung Electronics on March 18, 2026, to expand its AI infrastructure supply chain, focusing on next-generation memory and potential chip manufacturing, according to Reuters in its report .

The agreement positions AMD to secure critical components for its upcoming data center GPUs and CPUs as demand for AI compute continues to rise.

The deal centers on Samsung supplying high-bandwidth memory (HBM4) for AMD’s future Instinct MI455X accelerators, along with optimized DDR5 memory for its sixth-generation EPYC server processors.

HBM has become a key constraint in AI system deployment, with performance gains increasingly tied to memory bandwidth and efficiency rather than compute alone.