Microchip Launches 3.3 kV mSiC Modules for AI Data Center Transformers

On May 26, 2026, Arizona-based semiconductor company Microchip Technology, introduced a new family of 3.3 kV HV-D3 mSiC power modules aimed at solid-state transformer (SST) deployments in AI hyperscale data centers and other high-voltage systems.

“New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation,” Microchip Technology stated.

According to the company, the new modules integrate 3.3 kV silicon carbide (SiC) mSiC® MOSFETs and Schottky diodes in an industry‑standard 62 mm package, enabling efficient power delivery from the medium‑voltage grid directly to the server rack.

The move follows wider industry efforts to redesign AI infrastructure around power efficiency and grid limitations, including growing interest in distributed AI deployment models and alternative energy architectures. Similar pressures are already reshaping where hyperscale facilities are being built and how operators approach long-term electricity access