AMD Deepens Samsung Ties to Support Next-Gen AI Chips
Deal covers next-generation memory for AI GPUs and CPUs as AMD looks to diversify beyond TSMC
AMD signed a memorandum of understanding with Samsung Electronics on March 18, 2026, to expand its AI infrastructure supply chain, focusing on next-generation memory and potential chip manufacturing, according to Reuters in its report .
The agreement positions AMD to secure critical components for its upcoming data center GPUs and CPUs as demand for AI compute continues to rise.
The deal centers on Samsung supplying high-bandwidth memory (HBM4) for AMD’s future Instinct MI455X accelerators, along with optimized DDR5 memory for its sixth-generation EPYC server processors.
HBM has become a key constraint in AI system deployment, with performance gains increasingly tied to memory bandwidth and efficiency rather than compute alone.
Samsung’s HBM4 is designed to deliver higher throughput and lower power consumption for large-scale model training and inference workloads.
The companies are extending an existing relationship, where Samsung already supplies HBM3E used in AMD’s current MI350X and MI355X accelerators.
The agreement also includes discussions around expanding AMD’s manufacturing options. Samsung will explore acting as a foundry partner for AMD’s future chips, which would broaden AMD’s supplier base beyond its current reliance on Taiwan Semiconductor Manufacturing Company.
AMD has been scaling its AI hardware roadmap to compete more directly in the data center market. The company has secured multi-year supply agreements with large customers including Meta and OpenAI, increasing pressure on its ability to lock in upstream components such as advanced memory.
The partnership comes at a time when the global HBM market is tightening. Industry data cited by Reuters shows SK Hynix holding a majority share, while Samsung is working to expand its position. For AMD, diversifying suppliers reduces exposure to shortages and improves negotiating leverage in a constrained market.
AMD CEO Lisa Su visited Samsung’s semiconductor complex in Pyeongtaek, South Korea, ahead of the agreement, meeting executives including Chairman Jay Y. Lee and reviewing manufacturing operations.
The visit included discussions on deepening collaboration across both memory and chip production.
The companies have worked together for years across graphics and mobile technologies, including AMD’s GPU IP licensing to Samsung and prior memory supply arrangements.
This agreement expands that relationship into core AI infrastructure, where system performance depends on coordination between compute, memory, and fabrication.